Overview

SH-MobileL3V2 features an on-chip hardware dedicated audio DSP contributing to lower power consumption, together with enhanced viewing of terrestrial digital broadcasts functionality through the provision of image quality improvement functions. In addition, a camera interface that allows direct connection of a 5-megapixel-class camera module enables capturing large volumes of image data from a high-definition camera at high speed, and performing various kinds of display, such as electronic image zoom display, screen overlapping.
Key Features
(1) High-performance, low-power-consumption multi-CODEC video processing IP
(2) High-performance 266 MHz SH4AL-DSP CPU core
(3) On-chip image quality improvement functions providing versatile, high-quality video display
(4) On-chip hardware dedicated audio DSP contributing to lower power consumption
Specifications
Product name SH7362
CPU core SH4AL-DSP
Power supply voltage Internal: 1.1 V to 1.3 V
External: 2.5 V to 3.6 V or 1.65 V to 1.95V
Maximum operating
frequency		 266 MHz
Maximum processing
performance		 478 MIPS (at 266 MHz operation)
On-chip RAM
  • ILRAM: 4 Kbytes
  • RSRAM: 2 Kbytes
Cache memory 4-way set associative type, with separate 32 Kbytes for instructions and 32 Kbytes for data
X/Y memory (for DSP) 16 Kbytes
On-chip peripheral
functions
  • 5-megapixel camera support functions
  • VPU (H.264, MPEG-4, VC-1)
  • DMAC x 6 channels
  • MMU
  • SPU (24-bit dedicated audio DSP)
  • 24-bit TFT liquid crystal panel compatible LCD controller
  • Gamma correction function
  • Enlargement edge enhancement function
Interfaces
  • Dedicated interface (baseband LSI connection, etc.)
  • TS (Transport Stream) interface
  • 4-Gbit NAND/AND flash memory interface
  • Video I/O (camera module direct connection interface)
  • I2C bus interface
  • Clock synchronous serial interface x 1 channel
  • SIM card interface
  • Serial interface with FIFO x 1 channel
  • Asynchronous serial interface x 1 channel
  • Sound interface unit x 2 channels
  • SD memory card interface
  • High-speed serial interface
    (Sub LVDS type)
  • NTSC/PAL video encoder
  • Video output unit
Installed SDRAM 256-Mbit SDRAM
Package 281-pin BGA(9 mm x 11 mm x 1.4 mm, 0.5 mm pin pitch)