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	<title>Renesas Technology America: Latest News</title>
	<link>http://america.renesas.com/</link>
	<description>The latest news from Renesas Technology America</description> 
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	<copyright>Copyright 2010, Renesas Technology Corp.</copyright>
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	<lastBuildDate>Tue, 16 Mar 2010 15:37:00 GMT</lastBuildDate>
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<item>
  <title>NEC Electronics and Renesas Announce the New Organizational Structure and Personnel Changes Following Merger</title>
  <link>http://america.renesas.com/company_info/news_and_events/press_releases/press_release20100316.jsp?campaign=RSSNews</link>
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  <pubDate>Tue, 16 Mar 2010 15:37:00 GMT</pubDate>
  <description><![CDATA[<p>KAWASAKI, Japan, TOKYO, Japan, March 16, 2010 -- NEC Electronics Corporation (NEC Electronics; TSE: 6723) and Renesas Technology Corp. (Renesas Technology) today announced the new organizational structure and personnel changes of Renesas Electronics Corporation (Renesas Electronics), the new integrated company that will be formed on April 1, 2010 when the business integration (the &ldquo;Business Integration” or the &ldquo;Merger”) of the two entities is completed.</p>]]></description>
  <category>press release</category>
  <category>technology</category>
  <category>corporate</category>
</item>
<item>
  <title>Renesas Technology Announces 100MHz 32-bit RX62T Flash MCUs, Enabling the Design of Control Systems for Electric Motors and Inverters that are More Energy-efficient</title>
  <link>http://america.renesas.com/company_info/news_and_events/press_releases/press_release20100309.jsp?campaign=RSSNews</link>
  <guid>http://america.renesas.com/company_info/news_and_events/press_releases/press_release20100309.jsp</guid>
  <pubDate>Tue, 09 Mar 2010 17:04:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/company_info/news_and_events/press_releases/press_release20100309.jsp?campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2010/0309/RX62T_Appssm.jpg" align="left" width="160" height="104" border="0" hspace="7" alt="RX62T"/></a>SAN JOSE, Calif. ─ March 9, 2010 ─ Renesas Technology America, Inc., today announced the release of the RX62T group of microcontrollers (MCU). The new devices have strong eco-features and deliver the environmental performance now in high demand for motor-control and inverter-control applications. These 100MHz, feature-rich MCUs with no-wait flash memory illustrate how Renesas is using the goals of its corporate ‘Green Energy Initiative&rsquo; to drive chip design in eco-friendly directions. The RX62T devices allow manufacturers of embedded systems to better address the increased importance that buyers of products such as consumer, industrial and HVAC equipment give to energy efficiency. Primary applications span a wide range: solar inverters, air conditioners, washing machines, lighting controllers and power-factor controllers, among many others.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>technology</category>
  <category>digital home</category>
  <category>industry</category>
  <category>others</category>
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<item>
  <title>Renesas Technology Expands its Flagship RX Flash MCU Family, Adding Broad Capabilities: Ethernet, USB OTG, CAN, and TFT-LCD Control</title>
  <link>http://america.renesas.com/company_info/news_and_events/press_releases/press_release20100302.jsp?campaign=RSSNews</link>
  <guid>http://america.renesas.com/company_info/news_and_events/press_releases/press_release20100302.jsp</guid>
  <pubDate>Tue, 2 Mar 2010 19:16:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/company_info/news_and_events/press_releases/press_release20100302.jsp?campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2010/0302/Rene_RX_Chip_RX62Nsm.jpg" align="left" width="160" height="81" border="0" hspace="7" alt="RX62N and RX621 Flash 32-bit MCUs"/></a>San Jose, CA, March 2, 2010 &ndash; Renesas Technology America, Inc., the world&rsquo;s number one microcontroller (MCU) supplier, today introduced two new groups, the RX62N and RX621 Flash 32-bit MCUs that combine extreme high performance and low power consumption with diverse connectivity functions. These MCUs provide true single-chip solutions for demanding applications such as building and factory automation, medical monitoring and therapy equipment, security and fire alarm systems, climate control, home appliances, communication gateways and point-of-sale devices.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>technology</category>
  <category>digital home</category>
  <category>others</category>
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<item>
  <title>Renesas Technology to Release R8C/Mx MCU Series with Power Consumption among the Lowest in the Industry and First R8C to Support 1.8V Reprogramming</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20100209.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
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  <pubDate>Tue, 9 Feb 2010 17:07:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20100209.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2010/0209/R8C_Mxsm.jpg" align="left" width="160" height="112" border="0" hspace="7" alt="R8C/Mx"/></a>SAN JOSE, Calif. &ndash; Feb 9, 2010&mdash;Renesas Technology America, Inc., today announced the release of the R8C/Mx Series of low-pin-count MCUs with on-chip flash memory (flash MCUs) offering power consumption among the lowest in the industry and a cost optimized peripheral set for applications requiring low power consumption, such as motion detectors, electric toothbrushes, smoke detectors and dedicated safety sensors for home appliances.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>technology</category>
  <category>digital home</category>
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<item>
  <title>Renesas Expands Back-End Process Plant in Beijing by Adding New Building on Site</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20100203.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20100203.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Wed, 3 Feb 2010 17:15:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20100203.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2010/0203/nEO_IMG_F9F61369sm.jpg" align="left" width="160" height="107" border="0" hspace="7" alt="Renesas Building"/></a>Tokyo, February 3, 2010 &mdash; Renesas Technology Corp. today announced the completion of a new building involving an investment of approximately &yen;4 billion to increase microcontroller (MCU) production capacity at the back-end process plant of Renesas Semiconductor (Beijing) Co., Ltd. (RSB), in Beijing, China.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>technology</category>
  <category>corporate</category>
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<item>
  <title>NEC Electronics and Renesas Announce the New Executive Team Following Merger</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20100201.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20100201.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Mon, 1 Feb 2010 16:59:00 GMT</pubDate>
  <description><![CDATA[<p>KAWASAKI, Japan, TOKYO, Japan, February 1, 2010 -- NEC Electronics Corporation (NEC Electronics; TSE: 6723) and Renesas Technology Corp. (Renesas Technology) today announced candidates of the executive team that will be in place following the business integration (the &quot;Business Integration&quot; or the &quot;Merger&quot;) on April 1, 2010 (scheduled). All candidates of the new executive team at the new integrated company, to be called Renesas Electronics Corporation, are listed in Exhibit 1.</p>]]></description>
  <category>press release</category>
  <category>technology</category>
  <category>corporate</category>
</item>
<item>
  <title>Renesas to Release SH74552 and SH74562 MCUs with On-Chip Flash Memory and Compact Package for Advanced Driver Assistance System Applications</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20100128.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20100128.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Thu, 28 Jan 2010 17:36:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20100128.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2010/0128/PR_SH74552_Traffic_SuperHsm.jpg" align="left" width="160" height="89" border="0" hspace="7" alt="SH74552 & SH74562 MCUs"/></a>SAN JOSE, Calif. &mdash; January 28, 2010 &mdash;Renesas Technology America, Inc., today announced the SH74552 and SH74562 32-bit MCUs for advanced driver assistance system applications which are needed in automobile &ldquo;active safety” systems for obstacle detection, risk avoidance, etc. The SH74552 and SH74562 MCUs feature a compact 13 mm &times; 13 mm package, 160 MHz high-speed operation, 1 MB of high-speed on-chip flash memory, and on-chip functions such as 4-channel CAN.*1 Sample shipments will begin in May, 2010, in Japan.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>automotive</category>
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<item>
  <title>Renesas Technology to Start Mass Production of 12-Product Lineup of Energy-Efficient Low-Loss Power MOSFETs that Cover Wide Voltage Tolerance Ranges (40 V, 60 V, 80 V, 100 V) for Isolated DC-DC Converters</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091217.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091217.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Thu, 17 Dec 2009 16:44:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20091217.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1217/RJK1056DPBsm.jpg" align="left" width="160" height="128" border="0" hspace="7" alt="RJK1056DPB"/></a>SAN JOSE, Calif., December 17, 2009&mdash;Renesas Technology America, Inc., today announced a lineup of 12 10th generation power MOSFET products for isolated DC-DC converters*1 used in the power supplies of applications such as servers, communications equipment, and industrial equipment. The new power MOSFETs deliver reduced switching loss*2 for improved energy efficiency and cover a wide voltage tolerance range (40 V, 60 V, 80 V, 100 V). Mass production began on December 3, 2009.</p><br clear="all"/>]]></description>
  <category>memory</category>
  <category>technology</category>
  <category>industry</category>
  <category>networks</category>
  <category>others</category>
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<item>
  <title>NEC Electronics and Renesas Sign Merger Agreement</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091215a.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091215a.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Tue, 15 Dec 2009 19:23:00 GMT</pubDate>
  <description><![CDATA[<p>KAWASAKI, Japan, TOKYO, Japan, December 15, 2009 -- NEC Electronics Corporation (NEC Electronics; TSE: 6723) and Renesas Technology Corp. (Renesas) today announced they have entered into a merger agreement to integrate business operations at NEC Electronics and Renesas (the &quot;Business Integration&quot; or the &ldquo;Merger”) on April 1, 2010 (scheduled). The agreement is subsequent to the definitive agreement, which was signed on September 16, 2009. The Business Integration will become effective following the adoption of the resolutions at Extraordinary General Meetings of Shareholders of both NEC Electronics and Renesas and approval by relevant authorities.</p>]]></description>
  <category>press release</category>
  <category>corporate</category>
</item>
<item>
  <title>Renesas Technology Introduces Industry’s Highest Level Performance Ternary Content Addressable Memory (TCAM) Family Designed for Multi-Layer Packet Processing in Networking Equipment such as Routers and Switches</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091210.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091210.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Thu, 10 Dec 2009 16:44:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20091210.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1210/TCAM_R8A20410BGsm.jpg" align="left" width="160" height="106" border="0" hspace="7" alt="R8A20410BG TCAM"/></a>SAN JOSE, Calif., December 10, 2009&mdash;Renesas Technology America, Inc., today introduced a high-performance TCAM (Ternary CAM)*1 Series, comprising a portfolio of TCAM memory products to enable high-speed packet processing for networking equipment such as routers and switches. The first product in the series is the R8A20410BG TCAM which has a capacity of 20 Mbits and delivers industry-leading high-speed search performance of up to 360 MSPS (mega-searches per second)/Table. Sample shipments will begin in December, 2009.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>memory</category>
  <category>technology</category>
  <category>networks</category>
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<item>
  <title>Renesas Technology to Release MS7724, First Product in Renesas Multimedia Solution Line of Linux Platforms for Development of Systems Incorporating SH-Mobile R Series Application Processors</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091208.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091208.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Tue, 8 Dec 2009 17:31:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20091208.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1208/MS7724sm.jpg" align="left" width="160" height="116" border="0" hspace="7" alt="MS7724 "/></a>SAN JOSE, Calif., December 8, 2009&mdash;Renesas Technology America, Inc., today announced the development of the Renesas Multimedia Solution Linux*1 platform, which enables low-cost and rapid development of systems incorporating the SH-Mobile R Series*2 application processor for mobile devices. The first product in the series is the MS7724 platform for the SH-Mobile R2R (SH7724), the newest entry in the SH-Mobile R Series. Shipments began on November 26, 2009, in Japan.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>technology</category>
  <category>wireless</category>
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<item>
  <title>Renesas to Release DrMOS-Compliant R2J20653ANP for Notebook PC CPU Power Supplies with Industry’s Top Power Supply Efficiency of 91%</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091207.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091207.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Tue, 8 Dec 2009 00:04:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20091207.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1207/drmos_r2j20653anp_sm.jpg" align="left" width="160" height="110" border="0" hspace="7" alt="R2J20653ANP"/></a>SAN JOSE, Calif., December 7, 2009&mdash;Renesas Technology America, Inc., today announced the R2J20653ANP, an Integrated Driver-MOSFET for use in voltage regulators (VR) for the CPU, memory, etc., of notebook PCs. It complies with the integrated Driver-MOSFET (DrMOS) specification and combines a high-voltage tolerance supporting input voltages up to 27 V and the industry&rsquo;s top power supply efficiency of 91% (when operating with an input voltage of 20 V and an output voltage of 1.1 V). Mass production will begin on December 7, 2009.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>memory</category>
  <category>technology</category>
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<item>
  <title>SH-Mobile Application Engine 4 breaks into GHz Realm to open up an Entirely New User Experience and set the pace for True Multimedia Convergence</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091130.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091130.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Mon, 30 Nov 2009 17:24:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20091130.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1130/SH73720sm.jpg" align="left" width="160" height="112" border="0" hspace="7" alt="SH73720"/></a>SAN JOSE, Calif., November 30, 2009 &mdash; Renesas Technology America, Inc., today announced that it is sampling the SH-Mobile Application Engine 4 (SH73720), an ARM&reg; Cortex&trade; A8*1 based application engine running at maximum1GHz, targeted for next generation mobile phone and mobile device implementations. With the integration of various dedicated processing engines, the device features ultimate multimedia capabilities such as  full HD 1080p video recording, playback at 30fps, and high-speed 3D graphics rendering for sophisticated 3D UIs and an advanced gaming experience. Leveraging on Renesas&rsquo; market proven Image Signal Processor (ISP) technology, the SH-Mobile Application Engine 4 provides a state-of-the art 16Mpixel ISP for best visual quality while supporting full HD 1080p movie processing. Fabricated in Renesas&rsquo; optimized 45nm low power process and integrating a wealth of new and innovative power saving schemes, it exceeds the stringent power budget requirements of mobile phones.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>technology</category>
  <category>wireless</category>
  <enclosure url="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1130/SH73720sm.jpg" length="144686" type="image/jpeg"/>
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<item>
  <title>Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091109.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091109.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Mon, 9 Nov 2009 17:30:00 GMT</pubDate>
  <description><![CDATA[<p>KAWASAKI, Japan; TOKYO, Japan, November 9, 2009 -- NEC Electronics Corporation (NEC Electronics; TSE: 6723), Renesas Technology Corp. (Renesas), NEC Corporation (NEC; TSE: 6701), Hitachi, Ltd. (Hitachi; TSE: 6501 / NYSE: HIT), and Mitsubishi Electric Corporation (Mitsubishi Electric; TSE: 6503) today announced changes concerning the capital injection listed in its September 16, 2009 press release entitled &ldquo;NEC Electronics and Renesas Reach a Definitive Agreement on Business Integration”.</p>]]></description>
  <category>press release</category>
  <category>technology</category>
  <category>corporate</category>
</item>
<item>
  <title>Renesas Technology to Release SH7266 and SH7267 32-bit MCUs with Large-Capacity (1.5 MB) On-Chip SRAM</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091103.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091103.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Tue, 3 Nov 2009 17:03:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20091103.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1103/SH7266_PRsm.jpg" align="left" width="160" height="128" border="0" hspace="7" alt="SH7266 and SH7267"/></a>SAN JOSE, Calif. &mdash; November 3, 2009 &mdash; Renesas Technology America, Inc., today announced the release of a total of eight versions of the SH7266 and SH7267, two new high-performance 32-bit MCU products with an on-chip SRAM size of 1.5 MB, that are intended for embedded applications in the industrial and consumer fields such as displays for digital audio players or graphical dashboards. Sample shipments will begin in February 2010 in Japan.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>technology</category>
  <category>automotive</category>
  <category>digital home</category>
  <category>industry</category>
  <enclosure url="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1103/SH7266_PRsm.jpg" length="42386" type="image/jpeg"/>
</item>
<item>
  <title>Hitachi High-Technologies to Acquire Semiconductor Manufacturing Equipment Business from Renesas</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091028a.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091028a.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Wed, 28 Oct 2009 17:06:00 GMT</pubDate>
  <description><![CDATA[<p>TOKYO, Japan &mdash; October 28, 2009 &mdash; Hitachi High-Technologies Corporation (President: Hidehito Obayashi; Hitachi High-Technologies) and Renesas Technology Corp. (Chairman: Katsuhiro Tsukamoto, Renesas) today announced a basic agreement for the transfer of the semiconductor manufacturing equipment business of wholly owned Renesas subsidiary Renesas Eastern Japan Semiconductor, Inc. (President: Yukio Murayama; Renesas Eastern Japan Semiconductor) to Hitachi High-Tech Instruments Co., Ltd. (President: Yoshinao Kawasaki; Hitachi High-Tech Instruments), a wholly owned subsidiary of Hitachi High-Technologies. Scheduled for next spring, this business transfer is expected to enhance Hitachi High-Technologies&rsquo; semiconductor manufacturing equipment business and improve management efficiency.</p>]]></description>
  <category>press release</category>
  <category>technology</category>
  <category>corporate</category>
</item>
<item>
  <title>Renesas Technology to Release SH7777 (SH-NaviJ3) SoC for Dashboard-mounted Car Navigation and Infotainment Systems Offering Enhanced Audio and Video Functions</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20091027.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20091027.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Tue, 27 Oct 2009 16:26:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20091027.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1027/SH7777_PRsm.jpg" align="left" width="160" height="128" border="0" hspace="7" alt="SH7777 (SH-NaviJ3)"/></a>SAN JOSE, Calif., October 27, 2009 &mdash; Renesas Technology America, Inc., today announced the SH7777 (SH-NaviJ3), the third product in the SH-NaviJ Series of system-on-chip (SoC) devices for compact portable navigation and infotainment systems and low- and mid-priced dashboard-mounted car navigation and infotainment systems. It speeds up development through OpenGL&reg; ES1.1*1 support and offers enhanced multimedia functions such as terrestrial digital TV broadcast support. The SH7777 (SH-NaviJ3) makes it possible for developers to create AV navigation and infotainment systems that combine low cost and compact size in less time.  Sample shipments began in Japan on October 8, 2009.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>automotive</category>
  <enclosure url="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/1027/SH7777_PRsm.jpg" length="34065" type="image/jpeg"/>
</item>
<item>
  <title>Panasonic and Renesas Start Operation of New Development Line for Leading-Edge SoC Process Technologies at the Renesas Naka Site</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20090930a.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20090930a.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Wed, 30 Sep 2009 23:24:00 GMT</pubDate>
  <description><![CDATA[<p>Tokyo, September　30, 2009 - Panasonic Corporation and Renesas Technology Corp. announced today that they will concentrate their joint development functions for leading-edge SoC process technologies at the Renesas Naka site (in Hitachinaka City, Ibaraki Prefecture) and will start operation of their 28 to 32 nm process development line installed at that site on October 1, 2009. The two companies, by concentrating their joint development functions at the Naka site with its 300 mm wafer line and providing a joint development structure, are developing 28 nm process technologies. They are targeting the start of mass production in the near future.</p>]]></description>
  <category>press release</category>
  <category>technology</category>
  <category>corporate</category>
</item>
<item>
  <title>The World's First Commercial ITS Verification Test Carried out in Changchun City, China</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20090929a.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20090929a.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Tue, 29 Sep 2009 23:24:00 GMT</pubDate>
  <description><![CDATA[<p>Tokyo, September 29, 2009 - Renesas Technology Corp. and the city of Changchun, China have jointly carried out a verification test of the world&#039;s first commercial ITS&sup1; using public busses in Changchun City, China this month. The test was completed successfully. Renesas provided the WAVE terminal platform that implements WAVE&sup2; communication, a new wireless communication technology, and confirmed the realization of WAVE communication used in public busses.</p>]]></description>
  <category>press release</category>
  <category>technology</category>
  <category>wireless</category>
</item>
<item>
  <title>Renesas Technology America and Micrium Offer Free Real-time Kernel and Specially Priced Middleware for the SH7216, a Superscalar Microcontroller with up to 1MB Flash, FPU, Ethernet and CAN</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20090921.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20090921.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Mon, 21 Sep 2009 16:00:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20090921.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/0921/sh7216_pr_sm.jpg" align="left" width="160" height="128" border="0" hspace="7" alt="SH7216"/></a>SAN JOSE, Calif.&ndash;September 21, 2009&ndash;Renesas Technology America, Inc., and Micrium have announced a joint marketing program that allows customers buying the Renesas SH7216 SuperH&trade; microcontroller to obtain a free, single-product license for the high-quality Micrium real-time kernel, complete with email and phone technical support. Customers can also purchase middleware components at a 50% discount. The limited-time program&sup1; enables system engineers to quickly apply the power and functionality of the 100/200MHz, 32-bit RISC MCU in building/home automation and industrial motor control applications &mdash; and do so at less cost and with less engineering risk. The synergistic hardware/software combination enables customers to focus on the value-added features that differentiate successful electronic products.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <enclosure url="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/0921/sh7216_pr_sm.jpg" length="45123" type="image/jpeg"/>
</item>

<item>
  <title>Renesas Technology Unveils First Capacitive-Touch MCU, a R8C Device Integrating an Innovative Sensor Control Unit</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20090917.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20090917.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Thu, 17 Sep 2009 16:00:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20090917.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/0917/r8c_33tsm.jpg" align="left" width="160" height="128" border="0" hspace="7" alt="R8C/33T Capacitive-Touch MCUs"/></a>SAN JOSE, Calif. &ndash; September 17, 2009 &ndash; Renesas Technology America, Inc., today announced a new generation of microcontrollers (MCUs) with an on-chip Sensor Control Unit&sup1; (SCU) for capacitive-touch applications. The devices in the R8C/33T group combine the features of Renesas Technology&rsquo;s well-established R8C family with innovative on-chip hardware that implements sophisticated touch-sensor technology from OMRON Corporation.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>digital home</category>
  <enclosure url="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/0917/r8c_33tsm.jpg" length="44041" type="image/jpeg"/>
</item>

<item>
  <title>Renesas Technology to Release SH72546R MCU for Automotive Engine Control that Combines the Industry’s Largest On-Chip Flash Memory Capacity of 3.75 MB and High-Speed Operation</title>
  <link>http://www.america.renesas.com/fmwk.jsp?cnt=press_release20090910b.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://www.america.renesas.com/fmwk.jsp?cnt=press_release20090910b.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Thu, 10 Sep 2009 18:31:00 GMT</pubDate>
  <description><![CDATA[<p><a href="http://www.america.renesas.com/fmwk.jsp?cnt=press_release20090910b.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://www.america.renesas.com/media/company_info/news_and_events/press_releases/2009/0910/sh72546r_sh2a_mcu_sm.jpg" align="left" width="0" height="0" border="0" hspace="7" alt="SH72546R MCU"/></a>SAN JOSE, Calif., September 10, 2009 &mdash; Renesas Technology America, Inc., today announced the addition to the SuperH*1 Family of the SH72546R, a powertrain (automobile engine, transmission, etc.) control MCU that combines the industry&rsquo;s largest on-chip flash memory capacity of 3.75 MB and high-speed operation at 200 MHz. Sample shipments will begin in October 2009 in Japan.</p><br clear="all"/>]]></description>
  <category>press release</category>
  <category>mpu&amp;mcu</category>
  <category>automotive</category>
  <enclosure url="http://www.america.renesas.com/media/company_info/news_and_events/press_releases/2009/0910/sh72546r_sh2a_mcu_sm.jpg" length="91347" type="image/jpeg"/>
</item>
	<item>
  <title>Renesas Technology Environmental Report 2009 Issued</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20090910a.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20090910a.htm&amp;fp=/company_info/news_and_events/press_releases</guid>
  <pubDate>Thu, 10 Sep 2009 18:07:00 GMT</pubDate>
  <description><![CDATA[<p>Tokyo, September 10, 2009 - Renesas Technology Corp. today announced the release of the Renesas Technology Environmental Report 2009 (English edition). The report covers the domestic operations of Renesas, as well as its manufacturing subsidiaries overseas, summarizing environmental achievements in fiscal 2008 and goals for the future.</p>]]></description>
  <category>press release</category>
  <category>corporate</category>
</item>
	<item>
	  <title>ESC Boston, September 21-24, 2009</title>
	  <link>http://america.renesas.com/fmwk.jsp?cnt=eventsandseminars000204.htm&amp;fp=/company_info/news_and_events/events/&amp;campaign=RSSNews</link>
	  <guid>http://america.renesas.com/fmwk.jsp?cnt=eventsandseminars000204.htm&amp;fp=/company_info/news_and_events/events/&amp;campaign=RSSNews</guid>
	  <pubDate>Thu, 27 Aug 2009 22:00:00 GMT</pubDate>
	  <description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=eventsandseminars000204.htm&amp;fp=/company_info/news_and_events/events/&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/events/ESC_logo_Boston.jpg" align="left" width="145" height="55" border="0" hspace="7" alt="ESC logo"/></a>Visit the Renesas booth, #1108, at ESC Boston, September 22-23, 2009 (exhibits open), at the Hynes Convention Center. Industrial and medical solutions will be highlighted.</p><br clear="all"/>]]></description>
	  <category>mpu&amp;mcu</category>
	  <category>industry</category>
	  <enclosure url="http://america.renesas.com/media/company_info/news_and_events/events/ESC_logo_Boston.jpg" length="40476" type="image/jpeg"/>
	</item>
	<item>
  <title>NEC Electronics and Renesas Report on the Progress of Business Integration</title>
  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20090826.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20090826.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</guid>
  <pubDate>Wed, 26 Aug 2009 07:00:00 GMT</pubDate>
  <description><![CDATA[<p>KAWASAKI, Japan, TOKYO, Japan, August 26, 2009 -- NEC Electronics Corporation, Renesas Technology Corp., NEC Corporation, Hitachi, Ltd., and Mitsubishi Electric Corporation today announced that the companies decided to postpone the conclusion of a definitive agreement to integrate business operations at NEC Electronics and Renesas until the end of September.</p>]]></description>
  <category>press release</category>
  <category>corporate</category>
</item>
	<item>
	  <title>NEC Electronics and Renesas Report the Progress of Business Integration</title>
	  <link>http://america.renesas.com/fmwk.jsp?cnt=press_release20090728a.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
	  <guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20090728a.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</guid>
	  <pubDate>Tue, 28 Jul 2009 16:00:00 GMT</pubDate>
	  <description><![CDATA[<p>KAWASAKI, Japan, TOKYO, Japan, July 28, 2009 -- NEC Electronics Corporation, Renesas Technology Corp., NEC Corporation , Hitachi, Ltd., and Mitsubishi Electric Corporation today announced that the companies decided to postpone the conclusion of a definitive agreement to integrate business operations at NEC Electronics and Renesas until the end of August, which had been originally outlined at the end of July.
	</p>]]></description>
	  <category>press release</category>
	  <category>corporate</category>
</item>
	    <item>
			<title>Renesas debuts on YouTube!</title>
			<link>http://www.youtube.com/RenesasPresents</link>
			<guid>http://www.youtube.com/RenesasPresents</guid>
			<pubDate>Wed, 15 Jul 2009 10:00:00 +0900</pubDate>
			<description><![CDATA[<p><a href="http://www.youtube.com/RenesasPresents"><img src="http://www.renesas.com/media/support/rss_feeds/youtube.gif" align="left" width="56" height="50" alt="Renesas Presents, the offical Renesas YouTube channel" border="0" hspace="7" /></a>Check out demo videos and more on the official Renesas YouTube channel, <a href="http://www.youtube.com/RenesasPresents">Renesas Presents</a>.</p><br clear="all"/>]]></description>
			<enclosure url="http://www.renesas.com/media/support/rss_feeds/youtube.gif" length="3046" type="image/gif"/>
		</item>
		<item>
			<title>Renesas Technology Introduces Highest Level Performance 72-Mbit QDR II+ SRAM and DDR II+ SRAM Family</title>
			<link>http://america.renesas.com/fmwk.jsp?cnt=press_release20090707.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</link>
			<guid>http://america.renesas.com/fmwk.jsp?cnt=press_release20090707.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews</guid>
			<pubDate>Tue, 07 Jul 2009 10:00:00 -0700</pubDate>
			<description><![CDATA[<p><a href="http://america.renesas.com/fmwk.jsp?cnt=press_release20090707.htm&amp;fp=/company_info/news_and_events/press_releases&amp;campaign=RSSNews"><img src="http://america.renesas.com/media/company_info/news_and_events/press_releases/2009/0707/QDRII-SRAM_sm.jpg" align="left" width="200" height="133" alt="Renesas High Performance 72-Mbit QDR II+ SRAM and DDR II+ SRAM Family" border="0" hspace="7" /></a>SAN JOSE, Calif. &mdash; July 7, 2009 &mdash; Renesas Technology America, Inc., today announced the 72-Mbit Quad Data Rate II+ (QDR™II+) and Double Data Rate II+ (DDRII+) high-speed SRAM*1 product family for use in high-end routers and switches in next-generation communication networks. These SRAM products achieve the industry's fastest level operating speed and are compliant to the QDR Consortium*2 industry standard. </p><br clear="all"/>]]></description>
			<category>press release</category>
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